Optoelectronic semiconductor component having a semiconductor chip, a carrier substrate and a film and a process for its preparation

It is a semiconductor device (100) having a radiation-emitting semiconductor chip (1), a carrier substrate (2) and a film (3). The carrier substrate (2) has a top side (20) of electrically conductive contact tracks (21a, 21b) on. The foil (3) facing away from a from the carrier substrate (2) radiation exit side (10) of the chip (1) and on the top (20) of the carrier substrate (2) and electrically comprises conductive first conductor tracks (31a) on. In addition, the film (3) has openings (32a, 32b) which are arranged such that the semiconductor chip (1) via the first conductor track (31a) of the foil (3) with the first contact track (21a) of the carrier substrate (2) can be electrically contacted. Further, a method of manufacturing such a device is specified.