Stress-induced Vertical Deformations in state-of-the-art Power Modules: an Improved Electro-thermo-mechanical Approach

In this paper, an enriched version of a VHDL-AMS tool devoted to electro-thermo-mechanical simulations is presented. The major improvement consists in the evaluation of the vertical displacements of the layers in the domain. As a case study, the mechanical deformations and stress in a principle structure emulating a state-of-the-art multi-chip SiC-based power module are thoroughly examined. By means of the proposed approach, the vertical displacements were quickly investigated and quantified in a typical electro-thermo-mechanical stress test scenario.