Dynamic Thermal Management

As we demand more from our computing systems, they will be limited by power, energy, and thermal constraints. Without new paradigms of energy-efficient designs, producing information and communication technology systems capable of meeting the computing, storage, and communication demands of emerging applications will be unlikely. Architectural innovation in conjunction with suitable power and thermal management strategies is the key for designing high-performance yet energy-efficient massive multicore chips. This chapter focuses on incorporating dynamic thermal management on a multicore chip designed with long-range wireless shortcuts. The chapter shows that this improves the thermal profile of the chip while simultaneously providing lower latency and reduced network energy compared to a conventional mesh-based counterpart.