FinFETs and Their Futures

FinFET is a promising device structure for scaled CMOS logic/memory applications in 22 nm technology and beyond, thanks to its good short channel effect (SCE) controllability and its small variability. Scaled SRAM and analog circuit are promising candidates for finFET applications and some demonstrations for them are already reported. On the other hand, for finFETs production, quite a lot of process challenges are required due to difficult fin/gate patterning in the 3D structure, conformal doping to fin and high access resistance in extremely thin body, etc. The fin/gate patterning can be improved by optimization of patterning stack, patterning scheme and etch chemistry. Alternative doping techniques show good conformal doping in 3D structure in finFETs. High access resistance is reduced by junction optimization and strain boaster technique.