Method for manufacturing semiconductor wafer provided with adhesive layer, photosensitive adhesive, and semiconductor device

Provided is a method for manufacturing a semiconductor wafer provided with an adhesive layer, which includes: a step wherein a photosensitive adhesive layer is formed by applying a photosensitive adhesive to the whole one surface of a semiconductor wafer by a screen printing method; and a step wherein the photosensitive adhesive layer is brought into a B stage by exposure.