Bonding structure and a manufacturing method thereof

Bonding structure of the present invention, without the use of welding or an adhesive, to allow adhesion to the adherend. Bonding structure of the present invention includes a base (4), provided on the surface of the substrate (4), the tip is less spherical radius 300nm, a plurality of protrusions the radius of the section orthogonal to the longitudinal direction is 300nm or less and, equipped with a.