Low-kandHighThermalStable Fluorinated EpoxyMaterials ForAdvanced Microelectronic Packaging Applications

A novel fluorinated epoxy resin,1,1-bis(4glycidylesterphenyl)1-(3-trifluoro-methylphenyl)-2,2,2trifluoroethane (BGTF), wassynthesized andcuredwith hexahydro-4-methylphthalic anhydride (HMPA)and4,4'diaminodiphenyl-methane (DDM). As comparison, commercial available bisphenol-A typeepoxyresin (BADGE) wascured bythesamecuring agent. Itwasshowedthat the cured epoxyresins showedgoodthermal stability andgood mechanical properties. Thecured epoxyresins also exhibited lower dielectric constants andwater absorption thanthose of nonfluorinated epoxy. Clearly, thefluorinated epoxyresins havedecreased thedielectric properties andwater absorption duetotheintroduction oftheCF3groups intheepoxyresin backbone, compared withthenonfluorinated epoxy.