Design of a Vertical Interconnection Based on Micro-additive Manufacturing Technology

The design of a rectangular-coaxial vertical interconnection structure based on micro-additive manufacturing technology is presented in this paper. This vertical interconnection is realized with quasi-coaxial structure with square cross section composed of Sn-based solder balls and is designed to connect coaxial transmission lines at different layers. Simulation results show that the insertion loss is $\lt 0.2$ dB and the S 11 is $\lt -20$ dB from 0.1-110 GHz. In addition, the isolation between two vertical interconnections is higher than 50 dB.