Method The method of forming a transparent substrate having grooves formed element substrate and

The method of forming method of the transparent substrate and forming a trench element substrate, the method of forming a transparent substrate having a trench. First, a transparent substrate and a transparent conductive layer formed on a transparent substrate. Then, using a laser device generating a laser beam, and the laser irradiation of the transparent substrate and the transparent conductive layer to a first surface of the transparent substrate and the transparent conductive layer in contact with at least one groove formed on at least one visual pattern and removing the transparent conductive layer immediately above the trench, wherein the power of the laser is less than 8 watts. The method of forming the element substrate, the forming method comprising a transparent substrate having a trench, and filling a high molecular material layer in the trench.