MEMS heterogeneous packaged broadband electromagnetic induction vibration sensor and remote temperature sensor for industrial intelligent manufacturing

In this work, we provide self-powered vibration sensor with broadband vibration sensing capability of 20 Hz ∼ 2000 Hz by vertical assembly of 3D coils and magnet without conventional deep-etching process, remote/ contactless temperature sensor (20 °C ∼ 160 °C) under < 1 μWatt power consumption, low power interface circuit (gain ∼70) in low threshold voltage (∼0.25V) Fin-FET, and MEMS heterogeneous packaging technology to demonstrate the capabilities of integration multi-sensor with read-out interface circuit for detecting variant physical parameter in the same chip. Comparing conventional vibration sensor with our device, the completely new design concept of the latter in this work benefits ultra-low vibration frequency detection. It deserves to be mentioned the vertical assembly technology reduces the complex integration issue to improve the chip yield. We also reveal the stability of the proposed vibration sensor to detect vibrating behavior during 1.5 hr and over one month in the dry pump of Lam 2300 etcher and the grinding-head in conventional optical lens forming machine, respectively. Therefore, the multi-functional sensing platform profits the demanded applications like IoT or smart manufacturing in Industry 4.0.