The function chip connected to the package to form a laminated package

The present invention discloses a laminated package (the PoP), comprising: a substrate, a substrate having a plurality of traces; a first function chip, on top of the substrate, connected by a plurality of trace engaging member connected to the substrate; and a two function chips on top of the first function chip, is directly connected to the substrate. Another laminate package (PoP) comprising: a substrate, a substrate having a plurality of traces; a first function chip, on top of the substrate, the plurality of solder pad mask is defined by the engagement block connected to the solder SMD (SMD) connector connected to the substrate; and a second function chip on top of the first function chip, by joining a plurality of traces for direct connection to the substrate.