Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°C

Interfacial reaction and shear behavior of the joints between Au-29Sn (at.%) solder and Ni-xCu (x = 20 at.%, 40 at.%, 60 at.%, and 80 at.%) substrate alloys soldered at 350°C for various durations were investigated in this study. The results show that α(Au) is the common reaction product at the solder/substrate interfaces after a short-time reaction regardless of Cu content. As soldering goes on, another new Ni3Sn2 layer forms at the interface company with ordering of the α(Au) phase, AuCu I/Ni3Sn2 bi-layers formed at the Au-Sn/Ni-20Cu interface, or with AuCu III/Ni3Sn2 bi-layers at the Au-Sn/Ni-40Cu interface. If the content of Cu in the substrate is higher than 40 at.%, periodic layered structure and discontinuous Ni3Sn2 layers appear. In the couple of Au-Sn/Ni-60Cu, AuCu I + AuCu III/Ni3Sn2/α(Au) can be observed while AuCu3/Ni3Sn2/α(Au) forms in the couple of Au-Sn/Ni-80Cu. Shear fracture always occurs in the region near the Ni-20Cu substrate in Au-Sn/Ni-20Cu joints, whereas it appears in the reaction layer for the joint of higher Cu content. The shear strength of Au-Sn/Ni-60Cu and Au-Sn/Ni-80Cu joints achieves about 55 MPa as α(Au) phase forms but decreases remarkably due to pore formation after soldering for a long duration. Whereas, the shear strength of Au-Sn/Ni-40Cu joints can reach 62 MPa as the α(Au) phase forms at an early stage, and maintains above 52 MPa even soldered for a long duration because of the adequate thick α(Au) and AuCu III layer adjacent to substrate provides good bonding. The reason why the soldering joint of Au-Sn/Ni-40Cu possesses higher strength and a better stability exists is that high Ni concentration in α(Au) and the continuous Ni3Sn2 layer inhibit formation of Kirkendall pores.