Optimization of the e-beam sensitive bilayer CARL process for stencil mask making

Hardmask-less stencil mask making requires masks with a high aspect ratio. The bilayer CARL (chemical amplification of resist lines) process was evaluated and optimized with respect of generating irregular resist features below 180 nm in a film thickness of 750 nm. Especially the dry development was detailed investigated using statistical design and analysis of experiment. Processed CARL resist masks are compared with Top Surface Imaging results. Finally, results of a deep silicon etching process using the CARL resist masks are presented.© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.