Method for measuring expansion and shrinkage of printed circuit board, and printed circuit board

The invention discloses a method for measuring expansion and shrinkage of a printed circuit board, and the printed circuit board. The printed circuit board comprises two outer layer boards and at least two inner layer boards arranged between the two outer layer boards, wherein each side of each inner layer board is provided with a test point, and test points on opposite sides of each inner layer board are positioned in the same horizontal line or vertical line. Each side of each inner layer board is provided with the test point, the test points on the opposite sides of each inner layer board are positioned in the same horizontal line or vertical line, after the inner layer boards are pressed, whether the two test points of two opposite sides of each inner layer board are expanded or shrunk is measured, the expansion and shrinkage data can be accurately measured, and data support is provided for the subsequent adjustment or modification of inner layer film compensation; therefore, the adverse effect of the circuit board caused by expansion and shrinkage can be effectively improved and the rejection rate of the circuit board is reduced.