Light-emitting diode

LED comprising: a substrate with a high thermal conductivity, which has a mounting surface of the die-bonding; substrate mounted on a printed circuit board, which has an opening exposed portions of the substrate mounting surface, and has a horizontally extending outwardly to the outer edge of the substrate protruding portion; LED unit mounting surface of the mounting substrate, it is exposed in the opening in the printed circuit board; sealing resin material from above the LED unit; wherein the LED unit is connected to a circuit through hole is formed at the outer edge of the projecting portion, and external electrodes disposed on an upper surface and a lower surface of the through hole. Such an LED can enhance heat dissipation effect, it can produce light of high luminance, but also may be mounted on a mother board or lower surface.