Organic light emitting diode (OLED) substrate cutting system

The invention provides an organic light emitting diode (OLED) substrate cutting system which comprises a cutting tool and a rack. The cutting tool is fixed on the rack. The OLED substrate cutting system is characterized by further comprising a leading laser unit which is fixed on the rack and located in the front of the advancing direction of the cutting tool. Through adoption of the leading laser unit, the OLED substrate cutting system enables an OLED substrate to be cut to be heated and melted to form a laser hot melting area before the OLED substrate to be cut is cut. When the cutting tool encounters the hot melting area in the cutting process, the cutting tool can easily carry out cutting along the hot melting area. Consequently, the probability that waste products caused by cutting exist in OLED display units is reduced. In a preferable technical scheme, through adoption of a deflected knife wheel structure, the probability that the cutting tool encounters the hot melting area in the cutting process is further improved. Through additional arrangement of a vacuum corrugated pipe, waste materials generated in the cutting process are cleared up so as to prevent the waste materials from influencing cutting tool marks, and consequently the cutting yield of the substrates is further improved.