A housed electrical component

A packaged electrical component comprises a carrier substrate (10), a spring means (20) disposed on the carrier substrate (10), coupled to a chip (30) on a first side (31) of the chip to the spring means (20) is, and a cover member (100) disposed on the carrier substrate (10). The cover (100) is arranged over the chip (20) so that the cover member (100) touches the chip (30) at least at a second direction different from the first side (32) of the chip. The component has a small footprint and high impermeability to influences from the environment.