Packaging technology of highly-reliable surface mounting glass-packaged diode

The invention discloses a packaging technology of a highly-reliable surface mounting glass-packaged diode. The diode comprises a glass housing, a chip arranged in the glass housing and lead-out ends sleeving two ends of the glass housing. A soldering sheet is arranged between each of the lead-out ends and the chip. The lead-out ends are bonded to the glass housing, the soldering sheets and the chip via the high-temperature metallurgical technology. The metallurgical bonding structure is advantaged by high reliability, resistance to big current impact and small thermal resistance, is wide in working temperature range (from -55 DEG C to 125 DEG C) and is anti-high temperature welding. Parameters will not be deteriorated after the metallurgical bonding structure is arranged at a temperature of 550 DEG C for 15 minutes. Thus, thermal matching in whole working temperature range of the product is achieved; nitrogen is used as protective gas during the whole process, so the diode can be safely produced without use of danger gas; the manufactured diode is small in installation size, high in assembly density and light; and operation is simple and batch production or large-scale production can be easily achieved.