Addressing Next Generation Packaging and IoT with Glass Solutions

Abstract New requirements are emerging in electronics packaging. The ever-growing need for solutions for mobile communications and sensors that address the Internet of Things (IoT) brings about interesting new challenges. RF applications strive to move to higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect demands, and there is a continuous search for more cost-effective solutions for difficult packaging challenges. Glass provides numerous opportunities to address these needs. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion helps optimize warp in glass core substrates, and manage bonded stacks leveraging TGV and carrier applications. Glass forming processes allow to form in a panel format as well as wafer format at thicknesses as low as 100 μm, giving opportunities to optimize or eliminate current polishing type manufacturing methods a...