Pulsed deposition of ultra-thin copper foils

Ultra-thin 5-μm (197-μ-in.) copper foil was prepared by pulse plating onto stainless steel from an acid copper electrolyte which contained 2 ppm of a gelatin having a molecular weight (MW) below 50,000. In addition to theadvantage of being pinhole-free, the copper foil obtained was also free of internal stress. Moreover, these copper foils had high tensile strength to provide desired handleability.