Printed circuit board and method of manufacturing such a printed circuit board

There is provided a printed circuit board (10) with an insulating layer (45) and a conductor track (40). The circuit board (10) has a first portion (15), a second portion (20) and a third portion (25) wherein the second portion (20) (15) and the third section (25) is arranged between the first portion and connecting the first portion (15) to the third section (25) mechanically and electrically such that a main plane of extension of the first portion (15) is disposed inclined to a main plane of extension of the third section (25). The conductor track (40) has over the portions (15, 20, 25) extending conductor layer (41) and is guided arcuately in the second section (20). At least in the second section (20), the conductor track (40) on an electrically conductive solder layer (85) covering at least partially the conductor layer (41). Further, a method of manufacturing the printed circuit board (10) is specified.