The method of fabricating a semiconductor package including a magnetic shield

Form a crack in a grid on the active surface of the electrode terminals are formed in the wafer. And grinding the back side of the wafer facing the active surface. And attaching a tape to the active face of the wafer. And customizing the wafer by increasing the tape to the semiconductor chips. To form a shielding layer on the semiconductor chips and the tape. By cutting a shield layer between the semiconductor chips, the individualized semiconductor chips by the first shield pattern formed on the rear and side of the semiconductor chip. And attaching the semiconductor chip to the substrate. To form a second shield pattern in each active surface of the semiconductor chip. The semiconductor chips and the substrate is an electrical method for manufacturing a semiconductor package that is physically connected by a bonding wire is proposed.