A process for preparing an organic electronic device and an organic electronic component

The present invention relates to a method for producing an organic electronic component, wherein the component at least comprising comprises an organic electronic layer comprises a matrix, wherein the matrix contains as a dopant a metal complex containing at least one metal atom M, and at least a portion bound to the metal atom M ligand L wherein the ligands L have the structure independently of one another: where E and the substituents R and the substituents R wherein the deposition of the dopant takes place of at least one organic electronic layer by means of vapor deposition via a source, said source being configured so that the dopant undergoes collisions with at least one wall of the source.