resin-molded sensor device

Providing a resin-molded sensor device in which a sensor element that detects inertial force, such as acceleration or angular velocity, is mounted on a contact surface, and the whole is sealed with resin, the resin-molded sensor device has a high reliability by a sensor output error is suppressed or eliminated by an inclination or deformation of the sensor element or the contact surface is reduced or eliminated at the time of resin injection, wherein a resin-molded sensor device 100 includes: a circuit unit 10, which includes a sensor element 1 for detecting a physical size, a semiconductor chip 2, a contact surface 3, the shape of which in plan has any shape of a rectangle, a circle and an ellipse, and fixing connecting lines 5A to 5D and an outer contact line 4, which are to be connected with the contact surface 3; and a resin body 20, which seals the circuit unit 10, each of the fastening connection lines 5A is arranged to 5D respectively in division areas which are formed by dividing the form into four virtual areas when an intersection point O between the two axes L1 and L2 perpendicular to each other is applied are such that it coincides with a center of the shape of the contact surface. 3