Mounting method and mounting apparatus of the electronic circuit components

The mounting method of the present invention includes the steps of placing a (A) a substrate (1) a first liquid to a first region provided on one principal surface (11) of (2), (B) a second the liquid (3) at least one member (4) and the member-containing liquid containing the (5), and contacting the first liquid disposed in the first region (11) (2), (C ) by the one main surface removing the first liquid (2) and the second liquid (3), placing the member (4) a first region (11), it is included. The first liquid (2) is substantially insoluble in the second liquid (3). Wettability member (4) the first liquid to the surface of (2) is higher than the wettability of the member (4) a second liquid (3) to the surface of the.