Production method and the base substrate of the multilayer printed wiring board

Method for manufacturing a multilayer printed wiring board includes a first step of preparing a base material with a resin layer is laminated through the release agent layer on at least one major surface of the metal plate carrier, of the base material comprising a second step of laminating one or more layers of the build-up layer on the resin layer. Substrate thickness of the plate carrier, is 5μm or more 1600μm or less, and good. Peel strength of the plate carrier and the resin interlayer is less than or equal to 10 gf / cm or more 200 gf / cm, the better.