Microstructure, to processes for their preparation, to apparatus for bonding a microstructure and microsystems

The present invention relates to a microstructure, a method for preparation thereof, an apparatus for bonding a microstructure and a micro-system which is formed of two bond substrates and located between the bonding substrates structure comprising a reacted reactive layer system. The microstructure of the invention has a bonding substrate and a reactive multilayer system, is provided on the bonding substrate or on at least one provided on the bonding substrate adhesion and / or wetting layer is a deposited solder or bonding layer and the reactive multilayer system a deposited on the solder or bonding layer and / or the solder or bonding layer comprising deposited layer sequence of at least two multiple alternating nanolayers of different materials.