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Rolling Deformability of Cr-Cu Heat-Sink Material for Semiconductor Devices
Rolling Deformability of Cr-Cu Heat-Sink Material for Semiconductor Devices
2015
Hoshiaki Terao
Yukihiro Matsubara
Yukio Kimura
Hideaki Kobiki
Hiroki Ota
Keywords:
Semiconductor device
Heat sink
Materials science
Composite material
Correction
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