The optoelectronic component-and process for its manufacture

An optoelectronic component comprising an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are disposed. The first surface is adjacent to a molded article. A first pin and a second pin are embedded in the molded body and is electrically conductively connected to the first contact and the second contact connected. A protection diode is embedded in the molded body and is electrically conductively connected to the first contact and the second contact.