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Electroplating for Infineon Wafer-Level-Package Technology
Electroplating for Infineon Wafer-Level-Package Technology
2003
Axel Brintzinger
Thomas Andreas Andreas Meyer
Harry Hedler
Wolfgang Leiberg
Stefan Ruckmich
I. Uhlendorf
Keywords:
Wafer-level packaging
Electroplating
Electronic engineering
Wafer
Die preparation
Materials science
Embedded Wafer Level Ball Grid Array
Correction
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