Manufacturing method for light-emitting diode

The invention discloses a manufacturing method for a light-emitting diode. The method comprises the following steps of: providing a substrate, wherein a first metal layer and a second metal layer are respectively formed on the upper surface and the lower surface of the substrate and are both divided into a plurality of independent areas through ditches, a plurality of through holes penetrating through the first metal layer and the second metal layer are formed on the substrate, and metal connecting layers connecting the first metal layer and the second metal layer are formed on the inner wall faces of the through holes; filling an insulating material in each through hole; forming a metal reinforcing layer on the surface of each insulating material; providing a plurality of light-emitting chips, and electrically connecting each light-emitting chip to the adjacent first metal layer; forming a continuous packaging body covering the light-emitting chips on the metal reinforcing layers; and cutting the substrate along the through holes to form a plurality of independent light-emitting diodes. The yield of a product can be improved by the method.