Circuit connecting material, a film-like circuit connecting material using this connection structure and a manufacturing method thereof of the circuit member

The present invention is a circuit electrode 32 and the insulating layer 33 on the surface 31a of the circuit member 30 formed adjacent, and the electrodes 42 and the insulating layer 43 on the surface 41a of the substrate 41 is formed adjacent the substrate 31 in member 40, the edge 33a of the insulating layer 33 and 43, 43a is a circuit connecting material for connecting the main surfaces 31a, circuit members 30 and 40 to each other, which is thicker than the electrode 32, 42 as a reference 41a and hardness than the adhesive composition 51 and an average particle diameter of 1μm or more 10μm comprises conductive particles 12 is 1.961～6.865GPa, the curing treatment, 0.5 is the storage modulus at 40 ° C. 3GPa, and the one in which the average coefficient of thermal expansion from 25 ° C. to 100 ° C. is 30 to 200 ppm / ° C..