Substrate support member

PROBLEM TO BE SOLVED: To provide a substrate support member which can maintain high temperature uniformity and thermal efficiency even under heat treatment conditions at high temperature, are not damaged, and has sufficient corrosion resistance. SOLUTION: The substrate support member 42A is installed inside a reaction vessel 41 of a semiconductor manufacturing device 40A to be used for the heat treatment of a substrate W, the inside of which is provided with a space having a heating element 44A to be conducted and heated, and the substrate support member 42A consists of a material containing nickel by 95 wt.% or more. Among surfaces of the substrate support member 42A, a corrosion resistance film 45 consisting of nickel fluoride is formed at least on the surface exposed inside the reaction vessel. COPYRIGHT: (C)2010,JPO&INPIT