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3DStackedICdemonstratorusingHybridCollective DietoWaferBondingwithcopper ThroughSiliconVias(TSV)
3DStackedICdemonstratorusingHybridCollective DietoWaferBondingwithcopper ThroughSiliconVias(TSV)
2009
J. VanOlmen
W. Dehaene
K. Demeyer
Keywords:
Materials science
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