Thermal Management of Glass Panel Embedded Packages: Package Architecture vs. Power Density

This paper presents a first analysis of the thermal management and performance of glass panel embedded (GPE) packages, a novel fan-out packaging technology recently demonstrated for heterogenous integration, beyond the capabilities of emerging wafer level fan-out (WLFO) packages. In this package architecture, a glass substrate carrier is used, onto which cavity-embedded devices are attached. The active sides of these devices are exposed to enable formation of high-density multi-layered redistribution layer (RDL) wiring and direct board attach of the embedded package, providing two separate paths for heat dissipation - through the board and through the backside glass carrier. There are concerns on the ability of such a package architecture with glass materials notoriously considered as thermal insulators to handle high heat flux densities. To address this challenge and better understand the thermal performance of GPE packages, a parametric modeling study was carried out in ANSYS, considering a 10mm × 10mm logic chip embedded in a glass substrate. In summary, this paper establishes the thermal management and cooling strategy of innovative GPE packages with innovations in package architectures and simple solutions to enable direct chip cooling with integrated heat spreaders so as to handle the high heat fluxes associated with future electronics.