Stress Evolution in Sn Thin Films During Thermal Cycling

Finite Element Modelling and corresponding X‐ray and Electron Back‐Scatter Diffraction measurements have been used to investigate the development of strain in thin tin films during thermal cycling. The modeled average strain in the film was found to agree within 20% to the experimental result, although the strain within individual grains was found to vary dramatically as observed by electron backscatter diffraction and synchrotron microdiffraction.