Organic thin film transistors with novel thermally cross-linked dielectric and printed electrodes on flexible substrates

Abstract Organic thin film transistors (OTFTs) were fabricated and studied on polyimide substrate with poly(4-vinyl phenol- co -methyl methacrylate) (PVP- co -PMMA) dielectric thermally cross-linked with a new agent, p-tolyltrimethoxysilane (TTMS), followed by printed electrodes and solution processed bis(triisopropylsilylethynyl) pentacene. TTMS was found to be an effective cross-linking agent for the thermal cross-linking of PVP- co -PMMA, while the developed processes are compatible with solution-processed gate/source/drain and organic semiconductor. Thermogravimetric analyses, electrical characterizations, X-ray photoelectron spectroscopy, and cross-section scanning electron microscopy were used to characterize the resulting dielectric films formed using different amounts of the TTMS cross-linking agent.