Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook

The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment boosted the development on various electrolytic copper processes for different applications over the past several decades. There are 4 main drivers which forced the chemical supply industry to introduce new electrolytic copper processes with the new feature of "filling" capability over the years.