Active Heat Dissipation By Chip on Thermoelectric Cooler for High-Power LED

In this paper, we put forward an active heat dissipation by chip on thermoelectric cooler (chip-on- TEC) packaging structure for high-power light-emitting diode (LED). The chip-on- TEC packaging structure was produced by bonding the LED chips on the metal layer on the back side of cold side substrate of the TEC. On account of the Peltier effect of thermoelectric particles and the characteristics of low heat resistance of the packaging device, the heat produced by the chips is able to be absorbed by the cold side of the TEC and distributed into the air availably. The temperature in working of the packaging device when chip currents are 0.2A to 1.0A was researched by the thermal imitation research and package test minutely. The working temperature in TEC-operative of chip-on- TEC packaging structure is indeed decreased in each chip current state in comparison to that in TEC-inoperative. The chip-on- TEC packaging device decreases the temperature of LED chips from 232°C to 114°C when the chip current is 1.0A. Furthermore, the light output power of LED chips is greatly enhanced under various chip currents. The chip-on-TEC packaging structure is able to advance the light intensity effectively, and the light saturated point of the LED chips is increased from 0.8A to 1.0A because of the TEC. The study testify that the chip-on- TEC packaging device is a very feasible active heat dissipation approach for high-power LED.