Large Form Factor Hybrid LGA Interconnects; Recent Applications and Technical Learning

Recent high-end server design trends have continued to challenge electronic packaging engineers to design and integrate larger form factor land grid array (LGA) attached modules within their assemblies. These trends have included the application of larger, denser, organic packaged modules whose electrical performance and postencapsulation physical characteristics have been enabled by both the continued development of hybrid LGA connectors as well as new module actuation hardware designs. In this paper, we'll discuss these recent trends, including the specific technical attributes and challenges that need to be addressed to ensure a repeatable and reliable assembly design is developed. Initially, overviews of the latest connector and module design trends, including styles and physical sizes and their implications to the module's bottom surface metallurgy (BSM) flatness requirements, etc. are provided. Pursuant to this, recent system integration trending is reviewed; including both the module quantity per s...