Copper electrodeposition and additives: from underpotential deposition to bulk growth

Cu electrodeposition at different stages on Au(111) surface is accessed in-situ on atomic scale by means of our newly developed fast electrochemical STM. We show the effect of industrially used additives, such as bis-(3-sodiumsulfopropyl) disulfide (SPS) and polyethylene glycol (PEG), on the Cu deposit. The EC-STM results are complemented by electrochemical measurements and discussed in the light of current state of knowledge on electrodeposition and molecular processes involving the additives.