IC-package Optimization for Conducted EME Performance: Impact of Discrete Decoupling Capacitors and Parasitic Inductive Effects

In the evaluation of conducted emissions from digital integrated circuits, the package must be considered as fundamental contributor. The impact of small package design details becomes more significant with the increasing application frequencies, but the growing flexibility in terms of packaging technologies offers some powerful instruments to properly address the final performances. Goal of this paper is to analyze the impact on conducted emissions of two important package parameters: parasitic inductance and integrated decoupling capacitors. The trade-off between conducted emissions optimization and dynamic IR-drop reduction is also taken into account. All the presented results are obtained by system-level simulations considering die, package and board.