Method and apparatus for thermal treatment of objects

To provide better control of the temperature profile of an object to be treated during a thermal treatment to allow the present invention provides an apparatus and a method for the thermal treatment of an object in a heating system, in particular semiconductor wafers in a rapid heating unit, before, wherein the objects with a predetermined temperature profile are thermally treated and the temperature of the object is controlled with a PID control and a feed-forward control based on a simulation model of heating device and object, wherein the model consists of individual models of components of the heating device and / or the object and the parameters of at least one of the individual models monitored during the thermal treatment and the model is adapted to the monitored parameters.