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Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter
Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter
2017
Karasawa Yuki
Gotou Yusuke
Hara Shintaro
Fukuoka Takanobu
Miyaji Kousuke
Keywords:
Wire bonding
Buck converter
Flip chip
Hysteresis
Materials science
Optoelectronics
dc dc converter
Correction
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