A method of producing a coolable electronic component and assembly with an electronic component and a cooling element

The invention relates to a method of producing a coolable electronic component (12) by a cooling element (13) is connected thereto. According to the invention it is provided that the connection by pushing, also direct bonding referred to is produced, wherein the bonding surfaces of the electronic component (12) and the cooling element (13) are so smooth that in a transition between these two components (15) adhesion to cause a material connection. This adhesive bond can be further strengthened by subsequent cold welding. The advantage of the resulting transition (15) compared to transitions with a joining adjuvant lower thermal resistance, and therefore advantageously the electronic component (12) through the cooling element (13), are cooled effectively. The invention is also an assembly, which was prepared by the same procedure.