Effect of Temperature–Rate Strain Conditions on the Power Variables and Structurization During Hot-Forging of the Sintered Cu–2% Ti Billets

The effect of temperature–rate strain conditions in the free settlement of Cu–2% Ti billets sintered in the 100–700°C temperature range with a strain rate of 0.01 and 0.001 sec–1 on the power process variables and structurization are studied. It is observed some increase in the stress at ~400°C, while the general trend is the decrease in stress with increasing strain temperature. This is due to the dynamic strain age-hardening, accompanied with the release of the intermediate metastable and coherent β′-phase Cu4Ti. It is demonstrated that the intensity of compaction during free settlement increases with increasing temperature, strain rate, and the starting porosity of the samples. It is observed that with increasing degree of strain of the billet, it occurs a monotonic decrease in the average grain size of copper and crushing of titanium particles, whose intensity increases with increasing rate and temperature of the strain.