Ic one kind of halogen-free epoxy resin composition for encapsulation

The present invention discloses a halogen-free IC package epoxy resin composition, the resin composition comprising a polyfunctional epoxy resin, benzoxazine resin, a phosphorus-containing curing agent, an inorganic filler, a curing accelerator and a solvent. The toughness of rigid composition contained superb resin, and an inorganic filler gives a composition having a low expansion coefficient and excellent heat resistance, the laminate thus prepared composition is suitable for IC package substrate, and a combination of the above the laminate was prepared for the halogen-free compounds, flame retardant rating of UL94-V0 level.