Patterning Strategy for Monoelectronic Device Platform in a Complementary Metal Oxide Semiconductor Technology
2011
We report a patterning strategy for building the first monoelectronic device complementary metal oxide semiconductor (CMOS)-compatible platform, including a single-electron transistor (SET) and multiple coupled quantum dots. Aggressive hybrid lithography (e-beam and deep UV are combined) and plasma etching are used to form adapted silicon active areas and gates, with a minimum size of 14 nm and a pitch of 80 nm after etching. These aggressive dimensions enable the study of double dots, a key structure for the more complex quantum circuits emerging now.
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