Low Cost 400-Gbps Micro-Intradyne Coherent Receiver Using Chip-to-Chip Bonding and FPCB Wirings

A cost-effective 400-Gbps Micro-ICR using chip-to-chip bonding and DC and RF FPCB wirings has been developed. A BER of 2×10 −2 is achieved for an OSNR of 23.8 dB when receiving 512-Gbps (64-GBaud DP-16QAM) signals.