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Filling of 80 nm structures using a novel copper oxide reduction and reflow approach
Filling of 80 nm structures using a novel copper oxide reduction and reflow approach
2004
Laure Carbonell
Roger Palmans
Youssef Travaly
Zsolt Tokei
Alain M. Jonas
Sywert Brongersma
Karen Maex
Keywords:
Copper oxide
Materials science
Inorganic chemistry
Chemical engineering
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